ACTIVELY EXPLOITED
CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
| Vendor | Qualcomm |
|---|---|
| Product | Multiple Chipsets |
| Actively exploited | Yes |
| Added to CISA KEV | 5 Dec 2023 |
| CISA federal deadline | 26 Dec 2023 |
| Weakness (CWE) | CWE-416 |
Required action (CISA's text)
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Description (NVD)
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
SOURCES
Other Qualcomm flaws
- CVE-2026-21385: Qualcomm Multiple Chipsets Memory Corruption Vulnerability
- CVE-2025-27038: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
- CVE-2025-21480: Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
- CVE-2025-21479: Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
- CVE-2024-43047: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Data from NVD, CISA KEV, FIRST EPSS and vendor advisories. Updated 10 Nov 2026.