ACTIEF MISBRUIKT
CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
| Leverancier | Qualcomm |
|---|---|
| Product | Multiple Chipsets |
| Actief misbruikt | Ja |
| Toegevoegd aan CISA KEV | 5 dec 2023 |
| CISA-deadline (Amerikaanse overheid) | 26 dec 2023 |
| Zwakte (CWE) | CWE-416 |
Vereiste actie (tekst van CISA, Engels)
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Beschrijving (NVD, Engels)
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
BRONNEN
Andere lekken bij Qualcomm
- CVE-2026-21385: Qualcomm Multiple Chipsets Memory Corruption Vulnerability
- CVE-2025-27038: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
- CVE-2025-21480: Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
- CVE-2025-21479: Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
- CVE-2024-43047: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Gegevens van NVD, CISA KEV, FIRST EPSS en adviezen van leveranciers. Bijgewerkt 10 nov 2026.